Altair-Powered IoT Modules and Devices will be Showcased with Leading Partners at MWC in Barcelona, Including, Sierra Wireless, Sercomm, DT and Truphone – Showcasing of advanced IoT at MWC
Mobile World Congress 2019 Exhibition Preview
February 25-28, 2019
Barcelona
Executive Meeting Rooms Hall 2, EMR 2B4EX and EMR 2B2EX
World’s First LTE Smart Ring with Panic Button
Featuring new IoT at MWC, Sierra Wireless will be showcasing a new Altair-enabled “smart ring with Panic Button” from Nimb. The mobile IoT (LTE-M/NB-IoT) connected ring features a highly discreet built-in panic button that can be easily triggered in case of emergency. The ring is powered by Sierra’s AirPrime® HL7800 module, the world’s smallest multi-mode LPWA module, which includes Altair’s ALT1250 Cat-M1/NB-IoT chipset. It also benefits from the highly integrated GNSS positioning capabilities of that same chip.
The HL78 R2C smart ring will be demoing at the Sierra Wireless booth: Hall 4, Stand 4A30
Next Generation Trackers
Sercomm will be showcasing a number of new tracker devices, targeted for consumer and asset tracking scenarios. These devices are based on Sercomm’s TPM540 module, which incorporates Altair’s ALT1250 Cat-M1/NB-IoT chipset. They will feature a range of additional capabilities, including GPS, Wi-Fi, Bluetooth Low Energy and optional sensors.
Sercomm will be demonstrating these cutting-edge technological and innovative solutions at its booth: Hall 2, Stand 2G3.
A World First: Fully GSMA-Compliant Embedded SIM Functionality within an IoT Module
Truphone will be demonstrating the world’s first fully GSMA-compliant embedded SIM (eSIM) functionality on an IoT module. Truphone’s bootstrap connectivity technology enables the module to connect out-of-the-box to Low-Power Wide-Area networks in multiple countries. This, along with its GSMA-accredited M2M remote SIM provisioning system, allows the device to fetch a SIM profile from mobile operators for ongoing local connectivity.
The demo will be performed with STMicroelectronics’ Wafer Level Chip Scale Package (WLCSP) eSIM on Murata’s 1SE Cat-M1/NB-IoT module, incorporating the STM32L4 ultra-low powered MCU. Powered by Altair’s ALT1250 chipset, the 1SE module includes ultra-low power consumption, enhanced security features and a highly reduced form factor.
See the demo at Truphone’s booth: Hall 6, Stand 6M60
The First Global IoT Ecosystem
Deutsche Telekom will launch its IoT Solution Optimizer, the world’s most advanced IoT solutions shelf designed to reduce the associated costs and risks of introducing new IoT solutions. A scalable online tool, it will allow enterprises to optimize the performance of IoT applications across multiple vertical markets, including smart city services, security systems and asset tracking.
Deutsche Telekom will showcase Altair’s ALT1250 all-in-one cellular IoT solution as part of the IoT ecosystem exhibit at its booth: Hall 3, Stand 3M31.
GSMA eSIM / iSIM Workshop
Altair will be participating in the GSMA’s eSIM Seminar MWC19: From Specification to Live Products, exploring the challenges in deploying eSIM and bringing devices to market. Ilan Reingold, Altair’s VP Business Development and Marketing, will be a panelist on the session Beyond eSIM in IoT addressing issues relating to security, scalability and connectivity.
The eSIM/iSIM Workshop will take place on Thursday, February 28 from 09:00-11:00am at CC1, Level 1, GSMA Seminar Theatre 1 (South Entrance)
Meet Altair to learn about optimizing your IoT at MWC 2019 and learn more about how our cellular IoT chipsets can help with your IoT deployments. Contact the Altair team to set a meeting: https://altair.sony-semicon.com/upcoming-events/
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