Soracom has launched its integrated SIM (iSIM) technology and an iSIM-compatible cellular module based on Murata’s Type 1SC, providing a compact, low-power solution for global IoT connectivity. Developed in collaboration with Sony Semiconductor Israel, Murata, and Kigen, this innovation streamlines device manufacturing, enhances security, and simplifies IoT deployment at scale.
Press Releases
Semtech’s HL7900 5G LPWA Module Certified by Leading U.S. Carriers
Semtech’s HL7900 5G LPWA module, powered by Sony’s Altair ALT1350 chipset, has been certified by AT&T, T-Mobile, Verizon, and KDDI, ensuring seamless global IoT deployment. With ultra-low power consumption, integrated GNSS, short-range radio support, and future-proof 3GPP compliance, it simplifies IoT development for asset tracking, smart utilities, and industrial applications.
Telit Cinterion ME310M1-W1 IoT Module Unlocks Global Deployment Opportunities for Next-Generation Cellular LPWA Solutions
Telit Cinterion’s ME310M1-W1 IoT module, powered by Sony’s Altair ALT1350 chipset, has been certified by two major U.S. mobile network operators, enabling seamless global LTE-M IoT deployment. With flexible connectivity options, ultra-low power consumption, and future-proof 3GPP Release 17 compliance, it supports applications such as asset tracking, industrial sensors, and smart utilities.