In the news
Jun 20, 2012

Live LTE handover between TD and FDD demonstrated – Microwave Engineering Europe

Microwave Engineering Europe

By Jean-Pierre Joosting

June 20, 2012

Altair Semiconductor has announced that its FourGee-3100/6202 chipset successfully completed TD/FDD LTE live handover testing with Rohde & Schwarz. The test, which employed Altair’s FourGee™ chipset in an end-user device, successfully enabled seamless communication between different LTE modes, achieving an uninterrupted and continuous data session with low handover latency from a 20 MHz TD-LTE channel and a 10 MHz FDD channel and back.

The two companies are currently presenting a joint demo of their handover capabilities at the Global TD-LTE Initiative (GTI) Asia Conference.

Altair claims to be the first chipset manufacturer to achieve live TD/FDD LTE handover in commercially available devices. By allowing the two LTE duplex modes to operate interchangeably on the same device, as well as enabling global LTE roaming, this achievement has significant market implications.

“The ramifications of live LTE handover are major, addressing one of the LTE industry’s most desired goals – harmonization of all standard variants. Our baseband portfolio, complemented by our multiband radio chipsets, offer the market’s most flexible and global solution,” said Eran Eshed, Co-Founder and VP of Marketing at Altair Semiconductor. “Since introducing the industry’s first LTE chipset in 2009, Altair has consistently been first to market with introducing numerous important LTE features.”

Altair’s FourGee™ LTE chipset is one of the only commercial solutions supporting both FDD LTE and TD-LTE. The chipset supports all 3GPP Release 9 bands and is deployed for commercial use in numerous LTE markets around the world.